Takato Amami IPOA-001 101.
Category:1960 births
Category:Japanese women writers
Category:Living peopleThe present invention relates to methods and apparatus for fabricating small chip or wafer electronic devices, such as flash memory devices.
A variety of techniques have been employed for making small semiconductor devices, particularly flash memory devices. In one technique, the device is fabricated on a wafer having a large number of identical, spaced apart devices. Following the fabrication process, the wafer is diced into a plurality of individual, identical, small chips. The individual chips are then packaged to provide individual semiconductor devices.
Alternatively, the devices may be fabricated on a wafer and the entire wafer may be subsequently scribed and then diced into a plurality of individual, identical, small chips. Following the fabrication process, the wafer is then diced into a plurality of individual, identical, small chips, each chip corresponding to a single device. Following the fabrication process, the wafer is diced into a plurality of individual, identical, small chips, each chip corresponding to a single device. The semiconductor devices are then packaged to provide individual semiconductor devices.
In yet another technique, a large number of identical devices are formed on a single wafer or a portion of a wafer. The devices may be fabricated on a portion of a wafer, which is divided into a large number of identical regions or sub-portions. Each region includes an individual device area of a desired, predetermined size and shape. For example, the region may be a square having a side length corresponding to the size of a single device. Following the fabrication process, the wafer is diced into a plurality of individual, identical, small chips. Following the fabrication process, the wafer is diced into a plurality of individual, identical, small chips. The semiconductor devices are then packaged to provide individual semiconductor devices.
In a fourth technique, individual, small electronic devices are formed on a larger substrate, such as a semiconductor wafer, by an array of semiconductor fabrication tools, such as photolithography steppers. The array of semiconductor fabrication tools is typically arranged in a cluster, wherein each of the semiconductor fabrication tools is a single semiconductor device. For example, a cluster of photolithography tools may include a single stepper, such as a step-and-repeat tool, and a scanning stepper. The photolithography tools are typically arranged with sufficient spacing between adjacent semiconductor fabrication tools be359ba680
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